Heat dissipation component and method for manufacturing same

ABSTRACT

To provide a method for manufacturing a heat dissipation component having excellent heat dissipation properties, in which there is minimal return of warping after the bonding of a circuit board, and to provide a heat dissipation component manufactured using the method. Provided is a method for manufacturing a warped flat-plate-shaped heat dissipation component containing a composite part that comprises silicon carbide and an aluminum alloy, wherein the method for manufacturing the heat dissipation component is characterized in that the heat dissipation component is sandwiched in a concave-convex mold having a surface temperature of at least 450° C. and having a pair of opposing spherical surfaces measuring 7000-30,000 mm in curvature radius, and pressure is applied for 30 seconds or more at a stress of 10 kPa or more such that the temperature of the heat dissipation component reaches at least 450° C.

TECHNICAL FIELD

The present invention relates to a heat dissipation component and amethod for manufacturing the same.

BACKGROUND ART

In order to radiate heat generated from semiconductor elements, baseplates are joined to circuit boards to which semiconductor elements havebeen mounted and furthermore, heat dissipation components such asradiating fins are joined to the opposite plate surfaces of the baseplates. Aluminum or composites comprising aluminum alloys and siliconcarbide, having high thermal conductivity and thermal expansioncoefficients close to that of the circuit boards to which they arejoined, are used as base plates for such a purpose (Patent Document 1).

When using flat base plates for the above purpose, the stress generateddue to the difference in the thermal expansion coefficient of the baseplates and the circuit boards when the two are joined or the stressgenerated when packaging with resin sealants, etc. thereafter causes thebase plate surface side in close contact with the radiating fins, etc.to warp concavely, and sufficient adhesion cannot be obtained whenfixing radiating fins to base plates.

As means to solve this problem, there is art directed to warping theplate surface of base plates that are joined to radiating fins, etc.into convex shapes ahead of time (Patent Document 2).

Patent Document 1 JP H3-509860 A

Patent Document 2 JP H11-330308 A

SUMMARY OF THE INVENTION

However, there is the problem in conventional warp processing of, inenvironments such as heat cycling after mounting, the warping of thebase plates fluctuating.

Further, in methods in which warping is provided by heat processingwhile applying stress to a base plate, after soldering of ceramicsubstrates to base plates and packaging with resin sealants, etc., thereis the problem of so-called warp return being significant, wherein thesurface of the side brought into close contact with the intendedradiating fins is not convex but has a concave warped shape, resultingin poor heat dissipation.

According to the present invention, a method for manufacturing heatdissipation components having superior heat dissipation and small warpreturn after joining to a circuit board and heat dissipation componentsmanufactured via this method for manufacturing are provided.

The present invention provides a manufacturing method for a flatplate-shaped heat dissipation component having warp and including acomposite part comprising silicon carbide and an aluminum alloy, whereinthe method for manufacturing the heat dissipation component ischaracterized in that the heat dissipation component is sandwiched in aconcave-convex mold that has a surface temperature of at least 450° C.and that has a pair of opposing spherical surfaces with a curvatureradius of 7,000-30,000 mm, and in that pressing is performed for 30seconds or more at a stress of 10 KPa or more such that the temperatureof the heat dissipation component reaches at least 450° C.

According to one embodiment of the present invention, the manufacturingmethod is characterized in that the curvature radius is 20,000-30,000mm.

According to one embodiment of the present invention, the heatdissipation component manufactured by the manufacturing method ischaracterized in that, when the amount of warp per 10 an prior to thewarp being provided is set at X, the amount of warp per 10 cm after thewarp has been provided is set at (X+Y), and that when the amount of warpper 10 cm after heat treating the heat dissipation component afterwarping at a temperature no greater than 320° C. for at least 1 hour isset at (X+Z), Y and Z satisfy the relationship (Y−Z)<(Y/2).

According to one embodiment of the present invention, the manufacturingmethod is characterized by (Y−Z) being no greater than 18 μm.

According to one embodiment of the present invention, the manufacturingmethod is characterized by (Y/2)−(Y−Z) being 1-80 μm.

Further, according to the present invention, a heat dissipationcomponent is provided by any of the preceding manufacturing methods.

According to the present invention, a manufacturing method for a heatdissipation component having superior heat dissipation and small warpreturn after joining a circuit board and a heat dissipation componentmanufactured thereby can be provided.

SIMPLE EXPLANATION OF THE DRAWINGS

FIG. 1 A drawing explaining the amount of warp in a heat dissipationcomponent.

FIG. 2 A conceptual drawing explaining the press structure of themanufacturing method of an embodiment of the present invention, FIG.2(a) shows the pre-press state, FIG. 2(b) shows the state duringpressing, and FIG. 2(c) shows the post-press state.

MODES FOR CARRYING OUT THE INVENTION

Below, the present invention shall be explained in further detail viaembodiments. However, it is self-evident that the present invention isnot limited to these embodiments.

In the present invention, the “amount of warp” is defined by taking thecentral part of a flat plate-shaped heat dissipation component (thecentral part of a heat dissipation component may be the intersection ofdiagonal lines on a roughly rectangular plate surface in a heatdissipation component) as the center point, imagining straight linesconnecting the endpoints of line segments in the long side direction orin the short side direction of the plate surface of the heat dissipationcomponent to one another, and measuring, among lines perpendicular tothe straight lines, the length of a perpendicular line passing throughthe central part, which is the amount of warp.

For instance, in the example in FIG. 1, central part O of the heatdissipation component is the center point and P1 and P2 are theendpoints of line segments in the long side direction or the short sidedirection. Imagining a straight line connecting P1 and P2, L is thelength of a perpendicular line drawn from the straight line to centralpart O. At this time, setting the length of the straight line connectingP1 and P2 as M, the value of length L against length M is the amount ofwarp. For example, when length M is 10 cm, a value equivalent to lengthL is the amount of warp per 10 cm.

In the present invention, “spherical surface” can be defined as a curvedsurface created when a curved line on a flat surface is rotated around astraight line on the flat surface.

The manufacturing method for a heat dissipation component in the presentembodiment is a manufacturing method for a flat plate-shaped heatdissipation component having warp and including a composite partcomprising silicon carbide and an aluminum alloy, characterized in thatthe heat dissipation component is sandwiched in a concave-convex moldhaving a surface temperature of at least 450° C. and a pair of opposingspherical surfaces with a curvature radius of 7,000-30,000 mm, and inthat pressing is performed for 30 seconds or more at a stress of 10 KPaor greater such that the temperature of the heat dissipation componentreaches at least 450° C.

Via the manufacturing method provided with the above configuration, aheat dissipation component having superior heat dissipation due to goodadhesion when contacting other heat dissipation components such asradiating fins and in which warp return is small is provided. As aresult, it is possible to steadily and productively obtainhigh-reliability modules having semiconductor elements and the likemounted thereto.

In the present embodiment, a mold comprising two molds—a concave moldhaving a spherical shape with a curvature radius of 7,000-30,000 mm anda convex mold having a spherical shape with a curvature radius identicalto that of the spherical surface, (hereafter, this pair of molds isreferred to as a concave-convex mold) is used when applying stress tothe total surface of a base plate (heat dissipation component). A methodwherein the base plate is sandwiched between the spherical surfaces ofthe concave-convex mold plate and, while stress is applied in thedirection in which the base plate is sandwiched (while so-calledpressing is performed), the base plate is heated, is adopted.

In the above method, a method wherein the pair of molds is heated afterthe base plate is sandwiched ahead of time and pressing is performedwith a press, a method in which a load is applied, a method in which abase plate is inserted into a pair of molds already heated to apredetermined temperature and in which pressing is performed, or amethod in which, at this time, a base plate has already been heated,etc. may be adopted.

A press mold is as shown in FIG. 2 and has a press convex mold 2 and apress concave mold 3 that sandwich a heat dissipation component 1 (FIG.2(a)). The pair of the press convex mold 2 and the press concave mold 3face one another and sandwich the heat dissipation component 1 (FIG.2(b)) and via the use of a heating press under the above conditions, apredetermined warp is provided to the heat dissipation component 1 (FIG.2(c)).

Via the above method, a warp amount of 5-200 μm per 10 cm in the longside direction and in the short side direction may be provided to theheat dissipation component 1.

When joining circuit boards, due to differences in thermal expansioncoefficients thereof, forces generally work in heat dissipationcomponents such that convex surfaces face concave surfaces, thus,depending on the shape of a heat dissipation component, regions in whichparts have a concave shape can readily develop, but by making warpspherical, even if the aforementioned forces act, deformation is not tothe degree that some regions become concave, so joining of radiatingfins, etc. is sufficiently maintained when in modules andhigh-reliability modules can be obtained.

In the present embodiment, the composite comprises an aluminum alloy andsilicon carbide, so in the provision of warp, it is preferable that thebase plate be heated to a temperature as high as possible within atemperature range in which the aluminum or aluminum alloy part that isthe matrix of the composite does not melt, and it is specificallysuitable that treatment be performed in a temperature range of about450-550° C.

Further, stress of 10 KPa or greater is good and preferably should befrom 30 KPa to 250 KPa. The optimum stress may be determinedexperimentally in accordance with the plate thickness of the base plate,the temperature when warp is provided, etc.

In the present embodiment, it is standard for the heat dissipationcomponent to be heated by being sandwiched between heated sphericalmolds that face one another. Accordingly, for the composite itself toreach a temperature of at least 450° C., though it is affected by thethickness, surface area, etc. of the composite, if the heat dissipationcomponent is pressed for 30 to 300 seconds while the temperature of theheat dissipation component itself is substantially at least 450° C., aheat dissipation component having the characteristics of the presentembodiment can be obtained.

The material of the pair of the concave and convex molds used in thepresent embodiment does not matter as long as the material can maintainthe shape of the mold for the specified time at the heat treatmenttemperature of the present embodiment, but it is preferable that aceramic material such as carbon or boron nitride, or a metal materialsuch as an cemented carbide or stainless steel be used.

The press surfaces of the pair of press molds for pressing the heatdissipation component may have spherical shapes with a curvature radiusof 20,000-30,000 mm. By having a curvature radius of 20,000-30,000 mm,variations in the amount of warp due to heat treatment can be madesmall.

The heat dissipation component may be configured such that Y and Zsatisfy the relationship (Y−Z)<(Y/2) where X is the amount of warp per10 cm prior to warp being provided, (X+Y) is the amount of warp per 10cm after the warp has been provided, and (X+Z) is the amount of warp per10 cm after heat treating the heat dissipation component at atemperature no greater than 320° C. for at least 1 hour following thewarp being provided.

Concerning the provision of warp, the amount of warp per 10 cm prior towarp being provided is X μm, wherein when the amount of warp per 10 cmafter the warp has been provided is (X+Y) μm, the amount of warp per 10cm provided is Y μm. In addition, the amount of warp return is definedas (Y−Z) μm in cases in which a heat dissipation component in which theamount of warp per 10 cm is (X+Y) μm is heated at a temperature nogreater than 320° C. for at least 1 hour and the amount of warp per 10cm is (X+Z) μm.

In the above manufacturing method, by (Y−Z) satisfying the relationship(Y−Z)<(Y/2), warp return is small and a heat dissipation componenthaving superior heat dissipation can be provided.

By defining the relationship between the amount of warp prior to andfollowing heat treatment for at least 1 hour at the abovementionedtemperature as described above, the amount of warp provided can bemaintained at 50% or greater and, as a result, after actually solderinga ceramic circuit board or the like and furthermore, even afterpackaging with a resin sealant, etc., the radiating fin-fixing side ofthe heat dissipation component is maintained in a convex state, and amodule having excellent heat dissipation can be obtained.

(Y−Z) may be 18 μm or less. Due to the amount of warp return before andafter heat treatment being 18 μm or less, the shape of the heatdissipation component is kept uniform and a heat dissipation componentwith can productively be manufactured.

(Y−2)−(Y−Z) may be in the range 1-80 μm. By setting to this range, aheat dissipation component having even better adhesion and superior heatdissipation can be manufactured.

According to the manufacturing method of the present embodiment, a heatdissipation component having small amount of warp return after heatingand warp with a shape close to a spherical surface can be obtained.

A composite comprising both aluminum or an aluminum alloy and siliconcarbide in a three-dimensional network structure is preferably appliedas the composite comprising an aluminum alloy and silicon carbide usedin the present embodiment, and it is even more preferable that acomposite obtained by setting silicon carbide powder particles as amolded body and by impregnating a cavity of the molded body withaluminum or an alloy including aluminum, the composite having highthermal conductivity and a low expansion coefficient be used.

In order to obtain such a composite, for instance, high-pressure forgingcan be used. In high-pressure forging, with the objective of protectingagainst defects such as cracks occurring during the step of impregnatingaluminum or an aluminum alloy (hereafter referred to simply asaluminum), which will be discussed below, and of the obtained compositesatisfying properties such as high thermal conductivity, a low expansioncoefficient, and high strength, the silicon carbide is made into amolded body (preform) ahead of time, which can be impregnated withaluminum.

As a manufacturing method for a silicon carbide preform, widely-knownmethods such as a method in which a mixed powder in which siliconcarbide powder, an organic binder, an inorganic binder to maintainstrength following firing, etc. are mixed is, after press molding, firedand preformed in air or an inert atmosphere, a method in which,following the further addition of water or a solvent and a plasticizingagent, dispersing agent, or the like to the mixed powder and kneading,the mixed powder is extrusion molded and fired, an injection methodwherein the mixture is made into a low-viscosity slurry, injectionmolded in a mold, and fired, or a wet-pressing molding method whereinthe slurry is packed into a mold having a predetermined absorbency andpress molded can be adopted.

When used in the present embodiment, the content percentage of thesilicon carbide can be appropriately selected in accordance with theuse, but to obtain an aluminum-silicon carbide material base platehaving high thermal conductivity and an expansion coefficient of about6-9 ppm/K, regardless of the method used to manufacture a preform, it ispreferable that the relative density of the preform is at least 50% andmore preferably is at least 60%. In order to do so, it is effective toappropriately mix two or more raw material powders having differentparticle sizes as the silicon carbide raw material. The relative densitycan be measured via Archimedes' Method, etc.

In the step of impregnating a preform with aluminum and making acomposite, an aluminum-silicon carbide composite is manufactured byfeeding molten aluminum into the mold after the silicon carbide preformis set in the same, aluminum is impregnated in a cavity in the preformby pressing the molten aluminum, and cooling.

In order to smoothly perform impregnation at this time, the preform ispre-heated. Further, with the objective of improving low-temperaturemelting, ease of impregnation, and mechanical properties followingimpregnation, an aluminum-silicon based alloy containing 6-18 mass %silicon or, with the further objective of improving wettability with thepreform, an aluminum-silicon-magnesium based alloy to which 3 mass % ofmagnesium has been added, is used as the aluminum raw material to beimpregnated.

The alloy to be used can be selected arbitrarily, but in general, analuminum alloy melted at a temperature of 800-900° C. is impregnated. Analuminum-silicon carbide material composite manufactured via the abovemethod is, as-is or after the surfaces and periphery thereof aresubsequently machined into a predetermined shape and surface processingsuch as plating performed as necessary, made into a heat dissipationcomponent.

The heat dissipation component obtained through the above steps is, asstated above, flat and while uncontrolled warp does exist, according tothe method of the present embodiment, the heat dissipation component isone in which the amount of spherical warp is controlled.

According to the above method of manufacturing for a heat dissipationcomponent of the present embodiment, a heat dissipation component havinghigh adhesion with radiating fins even after being joined by solderingwith a ceramic circuit board or packaging with a resin sealant, etc. Isprovided.

EXAMPLES

Hereafter, the present invention shall be explained based on examplesand comparative examples.

Example 1

A preform having a relative density of 65%, comprising silicon carbide,and having dimensions of 179 mm×129 mm with a thickness of 4.9 mm wasset in a mold with a spout having a cavity with dimensions of 182 mm×132mm and a depth of 5.0 mm.

After heating at 600° C. for 1 hour, molten aluminum containing 12 mass% of silicon and 0.9 mass % of magnesium was then poured and viahigh-pressure pressing, a cavity in the preform was impregnated with thealuminum alloy. After cooling, an aluminum-silicon carbide composite wasobtained by removing same from the mold.

By machining the periphery of the obtained composite, the composite wasmade into a base plate having dimensions of 180 mm (referred to as thelong side)×130 mm (referred to as the short side) and a thickness of 5mm. At this time, the surface was covered by the aluminum alloy.

The amount of warp in the base plate was measured. Measurement of theamount of warp was performed with a three-dimensional laser shapemeasurement device (LK-G500 manufactured by Keyence Corporation) and themeasurement range was set so the center of the base plate was the centerpoint, at 100 mm in the long side direction and 100 mm in the short sidedirection.

The measurement positions in the long side direction and in the shortside direction were both lines passing through the center of the baseplate. The results of measuring the amount of warp indicated a warpedshape in which one side was convex in both the long side direction andthe short side direction and in which the opposite surface was concave.Regarding the convex surface, the maximum height on the line when bothedges of the measurement range are converted to zero, that is, theamount of warp, was investigated, coming to 16 μm in the long sidedirection and 14 μm in the short side direction.

In order to provide warp to the base plate, a concave-convex mold madeof stainless steel and provided with spherical surfaces having acurvature radius of 10,000 mm was prepared. The concave-convex mold wasmounted in a heat press and heated until the surface temperature of themold was 460° C. The base plate was placed inside the concave-convexmold and pressed at 40 KPa. At this time, the temperature was measuredby contacting a thermocouple with a side surface of the base plate.After maintaining for 3 minutes from the time the temperature of thebase plate became 450° C., rapid cooling was initiated and the pressurereleased.

The results of measuring the amount of warp on the convex surface sideof the obtained base plate were 135 μm in the long side direction and122 μm in the short side direction.

After further heating the base plate for 2 hours at 320° C., the resultsof measuring the amount of warp were 122 μm in the long side directionand 111 μm in the short side direction. These results are shown inTables 1 and 2.

TABLE 1 Amount of Warp Amount of Warp Heat Treatment Amount of WarpConcave- Warp Before Warp After Warp Conditions After After Heat ConvexMold Provision Press Press Provision (μm) Provision (μm) Warp ProvisionTreatment (μm) Curvature Temperature Pressure Time Long Short Long ShortTemperature Long Short Radius (mm) (° C.) (kPa) (min.) Side Side SideSide (° C.) Time Side Side Example 1 10000 450 40 3 16 14 135 122 320 2122 111 Example 2 7000 450 40 3 15 2 189 177 320 2 181 165 Example 320000 450 40 3 10 14 68 75 320 2 60 72 Example 4 30000 450 40 3 22 8 5847 320 2 54 46 Example 5 10000 550 10 0.5 4 11 118 120 320 2 102 108Example 6 10000 520 30 4 12 16 124 130 320 2 122 124 Example 7 15000 55010 0.5 12 17 105 101 270 3 98 96 Example 8 15000 450 40 4 6 30 99 94 2703 94 94 Example 9 15000 520 30 3 16 22 123 116 270 3 120 117 Comparative10000 550 8 3 32 6 154 146 320 2 72 61 Example 1 Comparative 10000 43010 0.5 15 26 104 108 320 2 58 62 Example 2 Comparative 10000 520 30 0.255 14 68 74 320 2 42 41 Example 3 Comparative 15000 650 10 0.25 18 5 106120 270 3 60 54 Example 4 Comparative 5000 450 40 4 16 18 — — — — — —Example 5 Comparative 35000 450 40 3 6 15 28 32 320 2 15 17 Example 6Comparative — 550 — 30 15 27 162 154 320 2 78 80 Example 7 Comparative —450 — 30 21 5 134 126 320 1 64 62 Example 8

TABLE 2 Difference in the Amount of Amount of Provided Is (Y − Z) <(Y/2) Warp Before and After Heat Warp/2 satisfied? Treatment (Y − Z)(Y/2) (Y/2) − (Y − Z) (Y − Z)/Y Long Short Long Short Long Short LongShort Long Short Side Side Side Side Side Side Side Side Side SideExample 1 Y Y 13 11 69.8 54 46.5 43 11% 10% Example 2 Y Y 8 12 87 87.579 76.5  5%  7% Example 3 Y Y 8 3 29 30.5 21 27.5 14%  5% Example 4 Y Y4 1 18 19.5 14 18.5 11%  3% Example 5 Y Y 16 12 57 54.5 41 42.5 14% 11%Example 6 Y Y 2 6 56 57 54 51  2%  5% Example 7 Y Y 7 5 46.5 42 39.5 37 8%  6% Example 8 Y Y 5 0 45.5 32 40.5 32  5%  0% Example 9 Y Y 3 1 53.648 50.5 47  3%  1% Comparative N N 82 85 61 70 −21 −15 67% 61% Example 1Comparative N N 46 46 44.5 41 −1.5 −6 52% 56% Example 2 Comparative N N46 33 41.5 30 −4.5 −3 55% 65% Example 3 Comparative N N 46 66 44 57.5 −2−8.5 52% 57% Example 4 Comparative — — — — — — — — — — Example 5Comparative N N 13 15 11 8.5 −2 −6.5 59% 88% Example 6 Comparative N N84 74 73 63.5 −11 −10.5 58% 58% Example 7 Comparative N N 70 64 58.660.5 −13.5 −3.5 62% 53% Example 8

Example 2

Other than a mold having a curvature radius of 7,000 mm being used, abase plate was treated using a method completely identical to that ofExample 1. The amount of warp at each step is shown in Tables 1 and 2.

Example 3

Other than a mold having a curvature radius of 20,000 mm being used, abase plate was treated using a method completely identical to that ofExample 1. The amount of warp at each step is shown in Tables 1 and 2.

Example 4

Other than a mold having a curvature radius of 30,000 mm being used, abase plate was treated using a method completely identical to that ofExample 1. The amount of warp at each step is shown in Tables 1 and 2.

Example 5

Other than the surface temperature of the mold being set to 560° C., thepress pressure being set to 10 KPa, and maintaining for 0.5 minutes (30seconds) from the point at which the temperature of the base platebecame 550° C., a base plate was treated using a method completelyidentical to that of Example 1. The amount of warp at each step is shownin Tables 1 and 2.

Example 6

Other than the surface temperature of the mold being set to 530° C., thepress pressure being set to 30 KPa, and maintaining for 4 minutes fromthe point at which the temperature of the base plate became 520° C., abase plate was treated using a method completely identical to that ofExample 1. The amount of warp at each step is shown in Tables 1 and 2.

Example 7

Other than a mold having a radius curvature of 15,000 mm being used, thesurface temperature of the mold being set to 560° C., the press pressurebeing set to 10 KPa, maintaining for 0.5 minutes (30 seconds) from thepoint at which the temperature of the base plate became 550° C., andfurther, setting the heat treatment following the provision of warp to 3hours at 270° C., a base plate was treated using a method completelyidentical to that of Example 1. The amount of warp at each step is shownin Tables 1 and 2.

Example 8

Other than a mold having a radius curvature of 15,000 mm being used, thepress pressure being set to 40 KPa and the maintenance time to 4minutes, and further, setting the heat treatment following the provisionof warp to 3 hours at 270° C., a base plate was treated using a methodcompletely identical to that of Example 2. The amount of warp at eachstep is shown in Tables 1 and 2.

Example 9

Other than the a mold having a radius curvature of 15,000 mm being used,the surface temperature of the mold being set to 530° C., the presspressure being set to 30 KPa, maintaining for 3 minutes from the pointat which the temperature of the base plate became 520° C., and further,setting the heat treatment following the provision of warp to 3 hours at270° C., a base plate was treated using a method completely identical tothat of Example 3. The amount of warp at each step is shown in Tables 1and 2.

Comparative Example 1

Other than the surface temperature of the mold being set to 560° C., thepress pressure being set to 8 KPa, and maintaining for 3 minutes fromthe point in time at which the temperature of the base plate became 550°C., a base plate was treated using a method completely identical to thatof Example 1. The amount of warp at each step is shown in Tables 1 and2.

Comparative Example 2

Other than the temperature of the mold being set to 440° C., thetemperature of the base plate being set to 430° C., the press pressurebeing set to 10 KPa, and the pressing time being set to 05 minutes (30seconds), a base plate was treated using a method completely identicalto that of Example 1. The amount of warp at each step is shown in Tables1 and 2.

Comparative Example 3

Other than the temperature of the mold being set to 530° C., thetemperature of the base plate being set to 520° C., the press pressurebeing set to 30 KPa, and the maintenance time being set to 0.25 minutes(15 seconds), a base plate was treated using a method completelyidentical to that of Example 4. The amount of warp at each step is shownin Tables 1 and 2.

Comparative Example 4

Other than a mold having a radius curvature of 15,000 mm being used, thetemperature of the mold being set to 560° C., the temperature of thebase plate being set to 550° C., the press pressure being set to 10 KPa,the maintenance time being set to 0.25 minutes (15 seconds), andfurther, setting the heat treatment following the provision of warp to 3hours at 270° C., a base plate was treated using a method completelyidentical to that of Example 1. The amount of warp at each step is shownin Tables 1 and 2.

Comparative Example 5

Other than a mold having a curvature radius of 5,000 mm being used andthe pressing time being set to 4 minutes, a base plate was treated usinga method completely identical to that of Example 1. Cracks wereconfirmed in the base plate during visual inspection following theprovision of warp.

Comparative Example 6

Other than a mold having a curvature radius of 35,000 mm being used, abase plate was treated using a method completely identical to that ofExample 1. The amount of warp at each step is shown in Tables 1 and 2.

Comparative Example 7

A base plate obtained with the impregnation method and machining of theperiphery in Example 1 and for which the warp has already been measuredwas placed in a 160 mm×120 mm cavity with a depth of 5 mm and the centerof the base plate was fastened with a screw and bent with the edge ofthe cavity as a fulcrum. In this state, the cavity and base plate wereinserted into a furnace, heated at 550° C. for 30 minutes, andthereafter, cooled. Following this, the screw fastening was released,heat treatment at 320° C. was performed for 2 hours after the providedwarp was measured, and the warp was measured once again. The results areshown in Tables 1 and 2.

Comparative Example 8

Other than the heating in the screw-fastened state being performed at450° C. for 30 minutes and the heat treatment following the release ofthe screw fastening being set to 320° C. for 1 hour, treatment wasperformed under conditions completely identical to Comparative Example7. The results are shown in Tables 1 and 2.

As can be understood from Tables 1 and 2, a heat dissipation componentmanufactured via the method of manufacturing of the present inventionhas the effects of warp return after joining a circuit board being smalland superior heat dissipation.

As above, according to the method of the present invention, a heatdissipation component having small warp return at such times as whenjoining with a circuit board, and through packaging following suchjoining, having a stable convex shape on a radiating fin side can bemanufactured, with the consequent result that it can be expected thatmodules having high heat dissipation and high reliability over longperiods can be steadily provided.

EXPLANATION OF THE REFERENCE NUMBERS

-   -   1 Heat dissipation component    -   2 Press convex mold    -   3 Press concave mold

1. A method for manufacturing a flat plate-shaped heat dissipationcomponent having warp and including a composite part comprising siliconcarbide and an aluminum alloy, characterized in that the heatdissipation component is sandwiched in a concave-convex mold comprisinga pair of opposing spherical surfaces having a radius curvature of7,000-30,000 mm and a surface temperature of at least 450° C. and inthat the heat dissipation component is pressed at a stress of at least10 KPa for at least 30 seconds such that the temperature of the heatdissipation component becomes at least 450° C.
 2. The method formanufacturing a heat dissipation component of claim 1, wherein theradius curvature is 20,000-30,000 mm.
 3. The method for manufacturing aheat dissipation component of claim 1, wherein a heat dissipationcomponent manufactured thereby satisfies the relationship between Y andZ of(Y−Z)<(Y/2), where X is the amount of warp per 10 cm prior to warp beingprovided, (X+Y) is the amount of warp per 10 cm after warp has beenprovided, and (X+Z) is the amount of warp per 10 an after heat treatingthe heat dissipation component at no greater than 320° C. for at least 1hour following the warp being provided.
 4. The method for manufacturinga heat dissipation component of claim 1, wherein the heat dissipationcomponent manufactured by the manufacturing method of claim 1 is suchthat (Y−Z) is no greater than 18 μm, where X is the amount of warp per10 cm prior to warp being provided, (X+Y) is the amount of warp per 10cm after warp has been provided, and (X+Z) is the amount of warp per 10cm after heat treating the heat dissipation component at no greater than320° C. for at least 1 hour following warp being provided.
 5. The methodfor manufacturing a heat dissipation component of claim 1, wherein theheat dissipation component manufactured by the method of claim 1 is suchthat (Y/2)−(Y−Z) is 1-80 μm, where X is the amount of warp per 10 cmprior to warp being provided, (X+Y) is the amount of warp per 10 cmafter warp has been provided, and (X+Z) is the amount of warp per 10 anafter heat treating the heat dissipation component at no greater than320° C. for at least 1 hour following warp being provided.
 6. A heatdissipation component manufactured via the method for manufacturing ofclaim 1.